PHOTOSTENCIL - Process Solution and Expertise for Printing Technology

ELECTROFORMED Stencil

AMTX E-FAB® electroformed stencils have set the standard for the SMT industry with superior printing characteristics and lower defect rates.

The AMTX E-FAB electroformed stencil is used extensively for (20 mil to 12 mil pitch) SMT applications.
It is also used for µBGA's, Flip Chip, and Wafer Bumping (12 mil to 6 mil pitch).  Photo Stencil is the exclusive manufacturer of the patented AMTX E-FAB stencil (including all improvements since 1998).

Download product sheet.

Click here to review the Electroforming Process.