Solder Paste Height Measurement System with 3D inspection

SPM-300-3D

Caltex Solder Paste Height Measurement System (SPM-300) is the low-cost QC solution for SMT manufacturing. One system with two functions: solder paste height measurement and video inspection & taking pictures. With zoom 50x-300x, the system is capable of measuring height or depth down to 0.001", plus measuring solder mask, trace, pads, pitch and through holes. When inspection is called for, 50x-300x zoom plus digital-video imaging on your PC is so easy on the eyes and so quick to capture defect images and email right from your computer. The system is both economical as well as easy to use for any SMT production floor. This tool is ideal for measuring solder paste to gain better printing process as well as quality inspection for post re-flow solder joints.

Key Benefits:

- True digital-video system for measurement, inspection, taking pictures, documentation, and email for SMT industry

- Measurement software & laser light for solder paste height measurement with simple mouse clicks

- Easy to use measurement for X-Y, Z height, radius, diameter, area, path length for lead pitch, through holes, components

- High accuracy measurement of 0.001 inch with 2 micron accuracy.

- Compare images with image library files

- Use the same system for multiple department: process, production, QC, failure analysis lab, R&D

- Wide zoom range 50x-300x (upgradeable to 20x-800x)

- 3D Rotational inspection add-on for solder joints, solder paste, and QFP leads-

- Three functions in one system: solder paste measurement, BGA inspection measurement, and 3D rotational inspection

- Low cost, easy to use, latest digital-video technology.