IC packaging

Phoenix|x-ray offers application-orientated products for the X-ray inspection of IC packages covering the entire inspection task range from process control to failure analysis.

package|inspector

• a sealed tube high resolution microfocus X-ray system dedicated to the inspection of integrated circuits

• an ultra high resolution microfocus X-ray system fitted with an open tube from phoenix|x-ray, dedicated to the failure analysis of IC packages

• an X-ray system with resoultion in the sub-micron range fitted with an open nanofocus® X-ray tube from phoenix|x-ray, dedicated to the inspection of finest details in IC packages, such as bond wire cracks etc.

• a compact bench-top X-ray system with high resoultion and sufficient magnification for the inspection of IC packages

• a software module for the image|optimiser / quality|assurance image processors offering automatic inspection of die attach voiding ... even on rotated or tilted dies.