Sony cellular F-series mounters are designed to meet today's production challenges by combining state of the art mounter technology for faster speed and higher accuracy with compact, space-saving design.
SI-F130 High Speed Modular Pick & Place
High speed chip mounter with compact design, superb connectivity, and dramatically reduced tact time
The SI-F130 has successfully
enhanced the efficiency and speed of chip mounting while meeting today’s
production requirements of space efficiency, connectivity and
operational flexibility.
Its compact, rotary planet head developed by Sony has enhanced actual
operating tact time by optimising the operational sequence without
compromising on accuracy.
The mounter’s compact, durable design allows optimal utilisation of
production space. Vibration analysis technology has been used to improve
vibration resistance and reliability.
The SI-F130 is already meeting future standards by supporting lead-free
production, splicing and traceability.
- SI-F130 Technical Specification
SI-F209 Fine Pitch Pick & Place System
High speed chip mounter with compact design, superb connectivity, and dramatically reduced tact time
The SI-F130 has successfully
enhanced the efficiency and speed of chip mounting while meeting today’s
production requirements of space efficiency, connectivity and
operational flexibility.
Its compact, rotary planet head developed by Sony has enhanced actual
operating tact time by optimising the operational sequence without
compromising on accuracy.
The mounter’s compact, durable design allows optimal utilisation of
production space. Vibration analysis technology has been used to improve
vibration resistance and reliability.
The SI-F130 is already meeting future standards by supporting lead-free
production, splicing and traceability
