Sony cellular F-series mounters are designed to meet today's production challenges by combining state of the art mounter technology for faster speed and higher accuracy with compact, space-saving design.
SI-G200 High Speed Mounter with Dual Head (45.000 cph)
The SI-G200 high-speed mounter is a two-head model inheriting the advantages of the cellular mounter, including high mounting precision, space saving design, and low power consumption. The high-performance mounter responds to various operational needs by allowing a flexible combination of its replaceable "high speed head" and "multifunction head" so as to best match the production line.
The new SI-G200 compact high-speed
mounter achieves tact times as low as 0.08s, equivalent to a sustained
placement rate of 45,000 components per hour (CPH), some 70% higher than
previous generation solutions. Sony's unique 12-nozzle "planetary" head,
combined with high-speed "flying" parts recognition via CCD, offers
placement accuracy as high as ±40µm.
With a small overall footprint and width of just 1.2m, the SI-G200
produces maximum return-on-investment (ROI) within valuable production
space, achieving component placement rates per square metre of up to
20,000 CPH/m². Its compact design is complemented by extremely high
energy efficiency, which cuts running expenses and enables Sony to offer
market-leading levels of energy costs when placing large numbers of
components.
Multiple SI-G200s can be connected in-line to meet production and
throughput demands: a typical 160,000 CPH line can be constructed from
four G-Series mounters, reducing linear space requirements by 50% and
capital expenditure by around 15%. Cassette loading is from both front
and rear, and transport direction can be right-to-left or
left-to-right/front, further increasing flexibility.
SI-F130 High Speed Modular Pick & Place (24ç900 cph)
High speed chip mounter with compact design, superb connectivity, and dramatically reduced tact time
The SI-F130 has successfully
enhanced the efficiency and speed of chip mounting while meeting today’s
production requirements of space efficiency, connectivity and
operational flexibility.
Its compact, rotary planet head developed by Sony has enhanced actual
operating tact time by optimising the operational sequence without
compromising on accuracy.
The mounter’s compact, durable design allows optimal utilisation of
production space. Vibration analysis technology has been used to improve
vibration resistance and reliability.
The SI-F130 is already meeting future standards by supporting lead-free
production, splicing and traceability.
- SI-F130 Technical Specification
SI-F209 Fine Pitch Pick & Place System
High speed chip mounter with compact design, superb connectivity, and dramatically reduced tact time
The SI-F130 has successfully
enhanced the efficiency and speed of chip mounting while meeting today’s
production requirements of space efficiency, connectivity and
operational flexibility.
Its compact, rotary planet head developed by Sony has enhanced actual
operating tact time by optimising the operational sequence without
compromising on accuracy.
The mounter’s compact, durable design allows optimal utilisation of
production space. Vibration analysis technology has been used to improve
vibration resistance and reliability.
The SI-F130 is already meeting future standards by supporting lead-free
production, splicing and traceability
SI-G200
SI-F130