Knowledge in Process

Looking for information about our products and services, including ACCEL, CAMALOT, ELECTROVERT, and MPM? Select a Speedline product and you'll find lots of technical information about the machine - white papers, datasheets, specifications and brochures.

Or, if you have interest in a specific process step such as underfill applications, stencil printers, wave soldering, or lead free processing you can use the Process and Application section of our website to learn more about what equipment we offer for that manufacturing step. We are the only supplier in the industry that offers equipment for virtually every step of the SMT manufacturing process as well as our full complement of semiconductor manufacturing equipment.

Product Offerings

Speedline Technologies provides a comprehensive line of assembly equipment solutions for the following processes and applications:

Circuit Board Printing and Dispensing

With more than 5,000 installations worldwide, Speedline Technologies is the world’s leading supplier of stencil printing and dispensing technology. The company’s stencil printing equipment provides a highly reliable, fast and accurate means of applying solder paste and other PCB materials. In addition, Speedline Technologies provides a variety of dispensing systems for applying solder paste, adhesives, fluxes and conductive epoxies. Wave Soldering – Speedline Technologies re-defined the wave soldering assembly process with the introduction of Lambda Wave. Today, Speedline offers the most sophisticated range of wave soldering technologies for both through-hole and SMT assembly requirements.

Reflow Ovens

Speedline Technologies has led the surface mount assembly market with the introduction of a series of reflow soldering systems that create many of the leading SMT and hybrid assembly products in use today. The company’s reflow ovens are designed to accommodate both surface mount assembly and new semiconductor packaging requirements.

Circuit Board Cleaning

Speedline's in-line, batch and centrifugal cleaning systems provide a range of solutions for both water and solvent-based removal of flux and residue.

Direct Chip Attach and Underfill

Speedline's dispensing equipment provides new approaches to surface mounting and component protection. Precision attachment of bare die using conductive adhesives, chip-on-board, or dam-and-fill encapsulation, and flip-chip underfill dispensing for environmental and thermal protection of die or chip packages.

Wafer Bumping

Manufacturers worldwide are embracing Ball Grid Array (BGA) and Chip Scale Packaging (CSP) technologies to manage increasingly smaller, more dense SMT and semiconductor packaging requirements. Responding to this challenge, Speedline has engineered a number of innovative solutions, including a wafer bump printing system.

Semiconductor Packaging and Encapsulation

Speedline's dispensing technology is engineered for the broadest range of component, semiconductor and hybrid assembly packaging applications. The company offers equipment designed to dispense solder paste onto IC substrates, circuit boards and wafers at high throughput rates.

Services - Speedline Technologies provides a wide variety of after-market service offerings to Speedline's customers. These services include: on-site service, customized service offerings and extended warranties, spare parts, instructor-based training, software and hardware upgrades.

Customers

Speedline Technologies serves customers worldwide. Typical customers include OEM’s and contract electronic manufacturers, as well as companies in the telecommunications, automotive electronics and medical electronics industries.