Compact Reflow-MINIOVEN for the desktop
The MINIOVEN 05 is a compact and robust table-top device specially designed for re-balling of BGAs and pre-bumping of QFN components. Its highly efficient hybrid heating technology heats-up the electronic components like in a standard reflow oven: Gently and simultaneously from all sides and guarantees repeatable process results with high yield. MINIOVEN 05 is perfect for use in both production and R&D environments.

The large display and the 4 button front panel layout enable fast set-up and administration of up to 25 re-balling profiles which can be saved in the device. Profiles can be taught with the device’s auto profiler software. The MINIOVEN 05 uses readings from a second temperature sensor which is connected to the oven and attached next to the BGA to measure the IC temperature. Aninput for thr use of process gasses (such as nitrogen) is factory set.

Multiple pre-bumping of QFN (here a 16-QFN-magazine)
Multiple pre-bumping of QFN (here a 16-QFN-magazine)
The PC software EASYBEAM is included and can be used to download profiles, i.e. for easy back-up and upload of re-balling profiles i.e. from a production server. EASYBEAM V2 connects via USB to the MINIOVEN 05 and can also display temperature plots of the two sensors and allows optimization of profile parameters to fit user expectations perfectly.

In addition to a wide range of tooling and accessories for BGA re-balling, holders, fixtures and stencils for QFN pre-bumping are available too. Stencils for a wide selection of QFN components are carried in stock.